封装代工
产品介绍
Products
陶瓷封装器件
引脚数量
外围尺寸
陶瓷QFP
32/64/80/100/128/144/176/208/256
10*10/12*12/14*14/20*20/24*24/28*28mm
陶瓷DIP
8/14/16/18/20/24/28/32/40/48/64
300mil/600mil/900mil
开腔QFN
陶瓷SOP
16/20/24/28/32/40/48/56/64/68/72/88/100
8/16/24
2*2/3*3/4*4/5*5/6*6/7*7/8*8/9*9/10*10/12*12mm
+2.5V
陶瓷PGA
陶瓷LCC
陶瓷BGA
84/100/132/256
28/32/48/64/84
case by case
757Hz
1100G
15G
设计能力
Design
制程能力
Process